We are developing and producing FPD Bonding and Inspection systems for manufacturing display panels such as LCD, OLED, LED etc. and securing world-class companies as customers based on our extensive experience and high technology in related industries.
Display devices always exist throughout our lives such as cell phones, TVs, computers, and car monitors, and high-quality display products make our lives richer.
We produce the equipment manufacturing of these display devices and have a number of related patents.
The process of cleaning, attaching, defrosting, and inspection are required for the production of display panels.
We manufacture the equipment which is necessary for the process of inspecting display panels and attaching other materials.
SAT produces the equipment needed to produce these high-quality displays and is consistently loved by major display manufacturers around the world for our outstanding technology.
This equipment automatically supplies the panels loaded on the PP BOX during the TFT LCD module process to attach a polarizer to the panels cleaned on the cleaning equipment.
| Vision System | Pol & Panel auto vision system |
|---|---|
| Touch Panel | Simple –to -use |
| Attachment Pressure & Vacuum Line | Simple to control on a touch panel |
| Attachment Method | Roll to Roll type (± 200㎛(3σ)) Roll to stage Type(± 50㎛(3σ)) |
| Material Supply | Cst type or RTS type |
This is a core equipment in the LCD module manufacturing process. This equipment directly thermo compresses the Drive IC for LCD operation on the panel that has completed cleaning and polarizing plate attachment using ACF.
| Vision System | Auto Aling Sytem |
|---|---|
| Touch Panel | Simple –to -use |
| Temperature | Constant Heating Method |
| Pressure Tool | Short Tool or Long Tool |
| Material | Simple to attach |
This system is used to compress with a pressure tool using pressure and temperature after adjusting the terminal on the LCD panel and the top and bottom positions of the FPC terminal during the TFT LCD MODULE process.
| Vision System | Auto Aling Sytem |
|---|---|
| Touch Panel | Simple –to -use |
| Temperature | Constant Heating Method |
| Pressure Tool | Short Tool or Long Tool |
| Material | Simple-to-install, Absorbing Shock Simple-to- remove and attach Cassette |
This system is used to compress using pressure and temperature after positioning the TAB terminal on the LCD panel and the top and bottom of PCB terminal in the next process of TAB during the TFT LCD MODULE process .
| Vision System | Auto Aling Sytem |
|---|---|
| Touch Panel | Simple –to -use |
| Temperature | Constant Heating Method |
| Pressure Tool | Short Tool or Long Tool |
| Material | Simple-to-install , Absorbing Shock Simple-to- remove and attach Cassette |
This system is used to compress using pressure and temperature after positioning the TAB terminal on the LCD panel and the top and bottom of PCB terminal in the next process of TAB during the TFT LCD MODULE process .
| Vision System | Auto Aling Sytem |
|---|---|
| Touch Panel | Simple –to -use |
| Temperature | Constant Heating Method |
| Pressure Tool | Short Tool or Long Tool |
| Material | Simple-to-install , Absorbing Shock Simple-to- remove and attach Cassette |
This equipment cleans the BOND LEAD section on the panel to remove debris and improve adhesion before attaching COG and TAB (COF) during the TFT LCD module process.
| Vision System | Auto Aling Sytem |
|---|---|
| Touch Panel | Simple-to-use |
| Clean Method | TYPE 1 : Ultra Sonic + IPA + Plasma TYPE 2 : IPA + Plasma etc... |
| Clean Speed | 100~ 250 mm/sec |
| Simple-to-change material | Simple-to-change material |
This equipment spreads resin at high pressure between the TFT and the C/F substrate to prevent foreign substances from entering the terminals, resulting in short circuits and corroding of the terminals during the TFT LCD module process
| AG Dotting | - |
|---|---|
| Top/Back application | Application Method : JET VALUE /Normal Nozzle Application Degree : Height/Length/Wide direction Spreading Flow /Path : Securing Tact time Hardening Method : natural hardening, UV Lamp hardening, able to choose according to user’s requirement |
This system inspects IC & FPC ALIGN SHIFT and ACF electric conductor ball compression on the panels which COG and FPC are attached to during the TFT LCD mode process.
| AOI Inspection | COG-Chip IC Dump/PANEL ACF Particle Deposition/Distribution FOG- FPC/PANEL Lead ACF Deposition/Distribution |
|---|---|
| Inspection Method | CCD Camera, Line Scan Type etc… |
This system is used to visually inspect the status of the screen by applying an image signal to the PCB after the process of PCB BONDING during the TFT LCD mode process
| FPC & Inspection Device of PCB | Automatic link |
|---|---|
| Inspection JIG Application of Index Type & 2 Station Type of 2Gig | Minimized Tact Time |
| Inspection JIG Quick Change and Publication | - |
This equipment is a printing equipment using PAD printing method to prevent lights from coming through PANEL GLASS EDGE.
| Absorber Table | INDEX Table Composition |
|---|---|
| INKING Method | TOP Printing. Instant Dry : 5minutes at 50℃ Bottom Printing, Aging Line : 1Hour at 50℃ |
| Ink Coating Thickness: Edge Inking | 0.01mm±0.003mm for 1 time print |
| PANEL Supply | Tray type |
It is a system that compresses with pressure and temperature using pressure tool after positioning the Patten of TAB terminal and LCD Panel terminal by precision CCD in the TFT LCD module process.
| Loading , Unloading | Manual |
|---|---|
| Motion | Auto |
It is a system that cuts according to the sizes setting substrate glass during the TFT LCD module process.
| Loading , Unloading | Manual |
|---|---|
| Motion | Auto |
This equipment is a system that joins PCB after compressing the LCD panel terminal and the TAB terminal in the TFT LCD module process.
| Loading , Unloading | Manual |
|---|---|
| Motion | Auto |
This is an industrial INK device that prints patterns uniformly where you want to print a pattern using the appropriate industrial INK which is suitable for the customer's needs.
| Features |
Reduction of Manufacturing Cost by Increasing Ink Use Efficiency Owning Function of Front Application ~ Part Application Able to Responding to Single-Phase Substrates Able to Deal with Thin Film ~ Thick Film |
|---|
본 장비는 CELL 공정에서 ITO Glass 위에 배향막을 균일하게 인쇄하는 시스템입니다
| 제품특성 |
고정도 Patterning 도포 실현 INK사용효율 UP에 따른 제조 비용 절감 단차 기판에 대응 가능 얇은 막 ~ 두꺼운 막까지 대응가능 |
|---|
This equipment automatically supplies the panels loaded on the PP BOX during the TFT LCD module process to attach a polarizer to the panels cleaned on the cleaning equipment.
| Vision System | Pol & Panel auto vision system |
|---|---|
| Touch Panel | Simple –to -use |
| Attachment Pressure & Vacuum Line | Simple to control on a touch panel |
| Attachment Method | Roll to Roll type (± 200㎛(3σ)) Roll to stage Type(± 50㎛(3σ)) |
| Material Supply | Cst type or RTS type |
This is a core equipment in the LCD module manufacturing process. This equipment directly thermo compresses the Drive IC for LCD operation on the panel that has completed cleaning and polarizing plate attachment using ACF.
| Vision System | Auto Aling Sytem |
|---|---|
| Touch Panel | Simple –to -use |
| Temperature | Constant Heating Method |
| Pressure Tool | Short Tool or Long Tool |
| Material | Simple to attach |
This system is used to compress with a pressure tool using pressure and temperature after adjusting the terminal on the LCD panel and the top and bottom positions of the FPC terminal during the TFT LCD MODULE process.
| Vision System | Auto Aling Sytem |
|---|---|
| Touch Panel | Simple –to -use |
| Temperature | Constant Heating Method |
| Pressure Tool | Short Tool or Long Tool |
| Material | Simple-to-install, Absorbing Shock Simple-to- remove and attach Cassette |
This system is used to compress using pressure and temperature after positioning the TAB terminal on the LCD panel and the top and bottom of PCB terminal in the next process of TAB during the TFT LCD MODULE process .
| Vision System | Auto Aling Sytem |
|---|---|
| Touch Panel | Simple –to -use |
| Temperature | Constant Heating Method |
| Pressure Tool | Short Tool or Long Tool |
| Material | Simple-to-install , Absorbing Shock Simple-to- remove and attach Cassette |
This system is used to compress using pressure and temperature after positioning the TAB terminal on the LCD panel and the top and bottom of PCB terminal in the next process of TAB during the TFT LCD MODULE process .
| Vision System | Auto Aling Sytem |
|---|---|
| Touch Panel | Simple –to -use |
| Temperature | Constant Heating Method |
| Pressure Tool | Short Tool or Long Tool |
| Material | Simple-to-install , Absorbing Shock Simple-to- remove and attach Cassette |
This equipment cleans the BOND LEAD section on the panel to remove debris and improve adhesion before attaching COG and TAB (COF) during the TFT LCD module process.
| Vision System | Auto Aling Sytem |
|---|---|
| Touch Panel | Simple-to-use |
| Clean Method | TYPE 1 : Ultra Sonic + IPA + Plasma TYPE 2 : IPA + Plasma etc... |
| Clean Speed | 100~ 250 mm/sec |
| Simple-to-change material | Simple-to-change material |
This equipment spreads resin at high pressure between the TFT and the C/F substrate to prevent foreign substances from entering the terminals, resulting in short circuits and corroding of the terminals during the TFT LCD module process
| AG Dotting | - |
|---|---|
| Top/Back application | Application Method : JET VALUE /Normal Nozzle Application Degree : Height/Length/Wide direction Spreading Flow /Path : Securing Tact time Hardening Method : natural hardening, UV Lamp hardening, able to choose according to user’s requirement |
This system inspects IC & FPC ALIGN SHIFT and ACF electric conductor ball compression on the panels which COG and FPC are attached to during the TFT LCD mode process.
| AOI Inspection | COG-Chip IC Dump/PANEL ACF Particle Deposition/Distribution FOG- FPC/PANEL Lead ACF Deposition/Distribution |
|---|---|
| Inspection Method | CCD Camera, Line Scan Type etc… |
This system is used to visually inspect the status of the screen by applying an image signal to the PCB after the process of PCB BONDING during the TFT LCD mode process
| FPC & Inspection Device of PCB | Automatic link |
|---|---|
| Inspection JIG Application of Index Type & 2 Station Type of 2Gig | Minimized Tact Time |
| Inspection JIG Quick Change and Publication | - |
This equipment is a printing equipment using PAD printing method to prevent lights from coming through PANEL GLASS EDGE.
| Absorber Table | INDEX Table Composition |
|---|---|
| INKING Method | TOP Printing. Instant Dry : 5minutes at 50℃ Bottom Printing, Aging Line : 1Hour at 50℃ |
| Ink Coating Thickness: Edge Inking | 0.01mm±0.003mm for 1 time print |
| PANEL Supply | Tray type |
It is a system that compresses with pressure and temperature using pressure tool after positioning the Patten of TAB terminal and LCD Panel terminal by precision CCD in the TFT LCD module process.
| Loading , Unloading | Manual |
|---|---|
| Motion | Auto |
It is a system that cuts according to the sizes setting substrate glass during the TFT LCD module process.
| Loading , Unloading | Manual |
|---|---|
| Motion | Auto |
This equipment is a system that joins PCB after compressing the LCD panel terminal and the TAB terminal in the TFT LCD module process.
| Loading , Unloading | Manual |
|---|---|
| Motion | Auto |
This is an industrial INK device that prints patterns uniformly where you want to print a pattern using the appropriate industrial INK which is suitable for the customer's needs.
| Features |
Reduction of Manufacturing Cost by Increasing Ink Use Efficiency Owning Function of Front Application ~ Part Application Able to Responding to Single-Phase Substrates Able to Deal with Thin Film ~ Thick Film |
|---|
This equipment is a system for uniformly printing an alignment layer on the top of ITO Glass during the CELL process.
| Features |
Spreading High-Precision Patterning Reduction of Manufacturing Cost by Increasing Ink Use Efficiency Able to responding to Single-Phase Substrates Able to deal with Thin Film ~ Thick Film |
|---|
